Document Type

Patent

Publication Date

11-6-2012

Patent Number

patent number 8304854

Abstract

Disclosed are a semiconductor integrated circuit chip, a multilayer chip capacitor, and a semiconductor integrated circuit chip package. The semiconductor integrated circuit chip includes a semiconductor integrated circuit chip body, an input/output terminal disposed on the outside of the semiconductor integrated circuit chip body, and a decoupling capacitor disposed at a side face of the semiconductor integrated circuit chip body and electrically connected to the input/output terminal. The semiconductor integrated circuit chip cab be obtained, which can maintain an impedance of a power distribution network below a target impedance in a wide frequency range, particularly at a high frequency, by minimizing an inductance between a decoupling capacitor and a semiconductor integrated circuit chip.

Application Number

12/270457

Assignees

Samsung Electro-Mechanics Co., Ltd. (Gyunggi-Do, KR); Clemson University (Clemson, SC, US)

Filing Date

2008-11-13

Primary/U.S. Class

257/532

Other/U.S. Class

257/535, 257/E23.057, 257/E29.343, 361/301.1, 361/306.1, 361/306.2, 361/306.3, 361/307, 361/308.1, 361/310, 361/734, 361/738

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