Document Type

Patent

Publication Date

1-29-2013

Patent Number

patent number 8361582

Abstract

A method for joining two or more substrates with a seam is provided. The seam is formed with a thermoplastic tape that is capable of forming an adhesive bond and a physical bond with a substrate. For instance, in one embodiment, the thermoplastic tape is formed from a polyurethane film. In addition, the seam can be utilized in a flat configuration or folded into a variety of different shapes, such as in a z-shaped configuration. As a result of the present invention, it has been discovered that a seam can be formed to have improved strength without substantially sacrificing the desired functional properties of the substrate materials.

Application Number

11/931971

Assignees

Clemson University (Clemson, SC, US)

Filing Date

2007-10-31

Primary/U.S. Class

428/57

Other/U.S. Class

428/58, 428/121, 428/214

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