Document Type
Patent
Publication Date
1-29-2013
Patent Number
patent number 8361582
Abstract
A method for joining two or more substrates with a seam is provided. The seam is formed with a thermoplastic tape that is capable of forming an adhesive bond and a physical bond with a substrate. For instance, in one embodiment, the thermoplastic tape is formed from a polyurethane film. In addition, the seam can be utilized in a flat configuration or folded into a variety of different shapes, such as in a z-shaped configuration. As a result of the present invention, it has been discovered that a seam can be formed to have improved strength without substantially sacrificing the desired functional properties of the substrate materials.
Application Number
11/931971
Assignees
Clemson University (Clemson, SC, US)
Filing Date
2007-10-31
Primary/U.S. Class
428/57
Other/U.S. Class
428/58, 428/121, 428/214