Dynamic Mechanical Analysis (DMA) data for thermoset based structural adhesive Henkel Teroson EP5089
Description
The attached data is the result of a temperature-frequency sweep performed on Henkel Teroson EP5089. The DMA data can be used to study the viscoelastic behavior of the epoxy-based thermoset adhesive.
Publication Date
12-10-2021
Publisher
Mendeley Data
DOI
10.17632/k6pggf8zxw.1
Document Type
Data Set
Recommended Citation
AGHA, AKSHAT (2021), "Dynamic Mechanical Analysis (DMA) data for thermoset based structural adhesive Henkel Teroson EP5089", Mendeley Data, doi: 10.17632/k6pggf8zxw.1
https://doi.org/10.17632/k6pggf8zxw.1
Identifier
k6pggf8zxw
Methodology
The tests were performed on a TA Instruments DMA for a temperature-frequency sweep. The frequency was varied from 0.1Hz to 100Hz for a temperature range of -50C to 200C. The storage modulus, loss modulus, and loss factor are provided.
Embargo Date
12-10-2021
Version
1
COinS