Document Type

Article

Publication Date

6-2021

Publication Title

International Journal of Adhesion and Adhesives

Publisher

Elsevier

DOI

https://doi.org/10.1016/j.ijadhadh.2021.102844

Abstract

The thermal loading during the curing process of an adhesive-bonded joint induces residual stresses in the joint, thereby affecting its performance. The problem becomes worse in the case of a multi-material joint involving varying coefficients of thermal expansion (CTE) for different parts. A novel approach was developed to model the properties of automotive grade structural adhesives during the heat curing process. The material model was divided into two components: curing kinetics model and viscoelastic mechanical model. The models were calibrated using experimental data from Differential Scanning Calorimetry (DSC) and Dynamic Mechanical Analysis (DMA) tests performed on an epoxy-based single-component adhesive. The calibrated material model parameters were fed into a finite element simulation and the prediction results were compared to a unique set of experiments utilizing two substrate combinations of adhesive-bonded single lap shear joints. An excellent agreement between the simulated and experimental results (displacement across the bond, force applied by the adhesive) was achieved. The modeling results give a better understanding of the residual stresses and agree with the experimental trend on the effect of bondline thickness on the joint.

Comments

The published version of this article can be found here: https://www.sciencedirect.com/science/article/pii/S0143749621000427

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